iQWafer integrates advanced terahertz imaging technology with AI-driven analytics to perform non-destructive, high-resolution scans of wafer substrates in real-time.

These terahertz sensors can penetrate the substrate surface to reveal minute defects and deviations often missed by conventional optical methods.

The system seamlessly integrates with existing production lines to provide continuous monitoring without throughput interruption.

AI algorithms rapidly analyze the imaging data to differentiate between critical defects and benign anomalies, flagging real-time alerts and enabling immediate corrective actions.

iQWafer's real-time resolution and defect visibility surpass current methods, significantly reducing yield losses and rework.

It offers economic feasibility by minimizing defects without sacrificing production speeds, creating a competitive edge for chip manufacturers.

Technologically, terahertz imaging is sophisticated yet viable, supported by recent advances in AI for real-time data processing.

Though initial costs are high, economies of scale and improved yields present compelling ROI.

Regulatory alignment is facilitated through adherence to EU semiconductor quality standards, but the competitive space is crowded with existing optical inspection incumbents.